Browse Prior Art Database

Silicon Wafer Pick Up Tool Fabricated of Polycarbonate Material

IP.com Disclosure Number: IPCOM000088855D
Original Publication Date: 1977-Aug-01
Included in the Prior Art Database: 2005-Mar-04
Document File: 2 page(s) / 24K

Publishing Venue

IBM

Related People

Rosenfeld, LH: AUTHOR [+2]

Abstract

The figures illustrate designs of several improved wafer vacuum pick-up tool tips. The tips are molded or machined from polycarbonate. These surface pick-up tools can be utilized in wafer loading and unloading operations.

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Silicon Wafer Pick Up Tool Fabricated of Polycarbonate Material

The figures illustrate designs of several improved wafer vacuum pick-up tool tips. The tips are molded or machined from polycarbonate. These surface pick- up tools can be utilized in wafer loading and unloading operations.

The surface pick-up pencil eliminates any wafer movement prior to or after processing. Contamination data has proven that wafer movement prior to processing increases surface contamination. Therefore, the illustrated tips can be used for pick-up of silicon wafers from the pattern or front side.

In the sputtered quartz deposition process, the surface pick-up pencil eliminates the wafer movement while loading or unloading from the anode plate. A stainless steel vacuum pencil was previously used on the back of the wafer. In addition to lower contamination levels, electrical parameters were evaluated using a test wafer to qualify the new tools.

The shapes of the pick-up tips are exemplary only. Other head designs could be utilized so long as the surface contact with the wafer is kept to a minimal size.

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