Browse Prior Art Database

Single Metallurgy System for Gas Panel

IP.com Disclosure Number: IPCOM000088885D
Original Publication Date: 1977-Aug-01
Included in the Prior Art Database: 2005-Mar-04
Document File: 2 page(s) / 58K

Publishing Venue

IBM

Related People

Aboelfotoh, D: AUTHOR [+6]

Abstract

In a gaseous discharge display device, orthogonal conductor arrays are formed on glass substrates and overcoated with a layer of dielectric, and individual cells located at the intersection of the pair of coordinate conductors are selectively energized by appropriate drive signals to produce a visible light output. The dielectric is formed by applying glass frit over the conductors and reflowing the frit, or by glass evaporation to produce a uniform layer over the conductor arrays. Copper conductors are preferred for their conductive properties, but copper does not adhere to glass.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 58% of the total text.

Page 1 of 2

Single Metallurgy System for Gas Panel

In a gaseous discharge display device, orthogonal conductor arrays are formed on glass substrates and overcoated with a layer of dielectric, and individual cells located at the intersection of the pair of coordinate conductors are selectively energized by appropriate drive signals to produce a visible light output. The dielectric is formed by applying glass frit over the conductors and reflowing the frit, or by glass evaporation to produce a uniform layer over the conductor arrays. Copper conductors are preferred for their conductive properties, but copper does not adhere to glass. One prior art solution to the metallurgy problem was a three layer system including a layer of copper conductor with a layer of chrome above and below the copper, the lower chrome layer providing adhesion to the glass and the upper layer, when oxidized, protecting the copper from attack by the active glass frit dielectric during reflow.

Referring to the drawing, a section of a gas panel is shown as comprising glass substrates 3 and 5 having conductors 7 and 9, respectively, the conductors comprising nickel metallurgy which is formed on the associated substrate by conventional photolithography processes. Dielectric layers 11 and 13 are formed over conductors 7 and 9, while associated secondary emissive refractory layers 15 and 17, such as magnesium oxide, are formed over dielectric layers 11 and 13, respectively, to protect the dielectric from sput...