Browse Prior Art Database

Metal Wool Heat Stud

IP.com Disclosure Number: IPCOM000088917D
Original Publication Date: 1977-Aug-01
Included in the Prior Art Database: 2005-Mar-04
Document File: 2 page(s) / 45K

Publishing Venue

IBM

Related People

Ronkese, BJ: AUTHOR

Abstract

The metal wool heat stud 10 is utilized to remove heat from the back side of a silicon device, such as a chip 12. The chip 12 is mounted pad-side down to a substrate 14 via conductive solder balls 16. The chip 12 is surrounded or enclosed by a can 18. The heat removal path is through the solder balls 16 to the substrate 14 and from the substrate through any pins 20 or along the substrate 14 to the can 18 where the can's outer surface acts as a heat sink. The metal wool heat stud 10 can be attached between the back of the chip 12 and the inner side of the top of the can 18. This provides a second heat transfer path for cooling the chip 12.

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Metal Wool Heat Stud

The metal wool heat stud 10 is utilized to remove heat from the back side of a silicon device, such as a chip 12. The chip 12 is mounted pad-side down to a substrate 14 via conductive solder balls 16. The chip 12 is surrounded or enclosed by a can 18. The heat removal path is through the solder balls 16 to the substrate 14 and from the substrate through any pins 20 or along the substrate 14 to the can 18 where the can's outer surface acts as a heat sink. The metal wool heat stud 10 can be attached between the back of the chip 12 and the inner side of the top of the can 18. This provides a second heat transfer path for cooling the chip 12.

The metal wool heat stud 10 is made from strands of wire, such as copper or steel, which are twisted together and then formed in a tool to produce a stud which is compressible, expandable and heat conductive. The stud 10 can be formed by compression into the desired shape and placed between the top side of the chip 12 and the bottom side of the can 18. This allows the chip 12 to operate at a lower temperature since there is greater heat transfer. This greater heat transfer will allow the chip to operate at a higher wattage than previously. The most important feature of the metal wool heat stud 10 is that it will compress and expand with appropriate temperature variations and, accordingly, maintain the contact interface between the chip 12 and the can 18 relatively constant.

It has been found that the heat tr...