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Cooling of Sputtering Cathode Made From Target Material

IP.com Disclosure Number: IPCOM000088944D
Original Publication Date: 1977-Aug-01
Included in the Prior Art Database: 2005-Mar-04
Document File: 2 page(s) / 37K

Publishing Venue

IBM

Related People

Lester, WC: AUTHOR

Abstract

To provide for the cooling of a target/cathode in a sputter vacuum deposition system, the entire face of the cathode is formed of the target material. The target material can be welded to the cooling water reservoir. Enhanced cooling of the target and improved electrical conduction between the target face and source results, thereby permitting thicker targets for longer service.

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Cooling of Sputtering Cathode Made From Target Material

To provide for the cooling of a target/cathode in a sputter vacuum deposition system, the entire face of the cathode is formed of the target material. The target material can be welded to the cooling water reservoir. Enhanced cooling of the target and improved electrical conduction between the target face and source results, thereby permitting thicker targets for longer service.

In Fig. 1, a sectioned magnetron sputtering system is shown including the target/cathode face 10 welded to the cooling water reservoir 11. The magnets 12 are spaced by spacers 13 from the target/cathode 10 for better coolant flow. The magnet support ring 14, shown in Fig. 2 in a sectional view along lines 2-2 of Fig. 1, also includes coolant flow slots 15 to allow the coolant to contact the target/cathode 10 directly in as many places as possible and to assist in coolant flow.

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