Browse Prior Art Database

Multicontact Chip Holder for Integrated Cryogenic Circuits

IP.com Disclosure Number: IPCOM000088966D
Original Publication Date: 1977-Aug-01
Included in the Prior Art Database: 2005-Mar-04
Document File: 2 page(s) / 45K

Publishing Venue

IBM

Related People

Perriard, L: AUTHOR [+2]

Abstract

This holder is suitable for integrated circuit chips with a size in the order of 6 x 6 mm/2/.

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Multicontact Chip Holder for Integrated Cryogenic Circuits

This holder is suitable for integrated circuit chips with a size in the order of 6 x 6 mm/2/.

The drawing gives a partial cut-away view of the structure. When the chip has been adjusted, pressure is applied to the pressure plate. The insulating cantilever is resilient and distributes the applied pressure well over all contact pads. Going to lower temperatures will increase the contact force as the expansion coefficient of the conductive layer at the bottom side of the cantilever is larger than that of the insulator.

The insulating parts of the holder are machined from acryl-glass and epoxy resin. The conductors are etched from a copper layer and gold-plated before the indium contacts are applied. For a 6 x 6 mm/2/ chip the cantilever is about 3 mm long and 0.5 mm thick, and the conductive layer is 70 Mu m thick and 200 Mu m wide.

A chip holder with 68 contacts operates satisfactorily at room temperature as well as in liquid helium. Further miniaturization with an increased number of contacts per length is possible, if required.

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