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Browse Prior Art Database

Integrated Circuit with Increased Air Dielectric

IP.com Disclosure Number: IPCOM000088976D
Original Publication Date: 1977-Aug-01
Included in the Prior Art Database: 2005-Mar-04
Document File: 2 page(s) / 47K

Publishing Venue

IBM

Related People

Brennan, PA: AUTHOR [+3]

Abstract

In integrated circuit structures an advantageous packaging configuration has conductive lines on the bottom surface of one substrate proximate to a ground plane such that the air space, which separates the conductors from one another and the ground plane functions, is a dielectric medium.

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Integrated Circuit with Increased Air Dielectric

In integrated circuit structures an advantageous packaging configuration has conductive lines on the bottom surface of one substrate proximate to a ground plane such that the air space, which separates the conductors from one another and the ground plane functions, is a dielectric medium.

An example of a cross-sectional view of an embodiment of this configuration is illustrated in Fig. 1.

An improved configuration, which allows more air dielectric space, particularly between each of the conductive lines, as well as between the conductive lines and the ground plane, is illustrated in cross-section in Fig. 2.

The advantages of the described configurations, particularly that of Fig. 2 are increased characteristic impedance, reduced noise coupling because the air gap increases the length of the flux lines for the capacitive coupling. Also, an optimum propagation velocity is realized because the majority of the conductive wire is in an air dielectric.

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