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Anisotropically Conductive Film

IP.com Disclosure Number: IPCOM000089025D
Original Publication Date: 1977-Sep-01
Included in the Prior Art Database: 2005-Mar-04
Document File: 2 page(s) / 36K

Publishing Venue

IBM

Related People

Lee, FM: AUTHOR [+2]

Abstract

Anisotropically conductive thin film 10 includes a layer of high conductive spheres 11. The tops and bottoms of spheres 11 protrude through a polymer, e.g., polyethylene, sheet 12 in which they are encapsulated. A removable fluorinated-ethylene-propylene cover 13 acts as a temporary carrier for handling film 10. Film 10, with cover 13 removed, is placed between mating pads (not shown) of a pad-to-pad printed-circuit-type connection, and provides a low resistance and highly reliable connection.

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Anisotropically Conductive Film

Anisotropically conductive thin film 10 includes a layer of high conductive spheres 11. The tops and bottoms of spheres 11 protrude through a polymer, e.g., polyethylene, sheet 12 in which they are encapsulated. A removable fluorinated-ethylene-propylene cover 13 acts as a temporary carrier for handling film 10. Film 10, with cover 13 removed, is placed between mating pads (not shown) of a pad-to-pad printed-circuit-type connection, and provides a low resistance and highly reliable connection.

Spheres 11 may be any highly conductive metal or alloy, and preferably have a high hardness to provide a Hertz effect. For example, spheres 11 may be Cu, BeCu, BeNi, Ni and CuAg, and are preferably coated with a precious metal such as Au or Pd. Other polymers 12, such as polypropylene, can be used for film 10.

In one method of making the film 10, initially the spheres 11 are deposited, e.g., by sprinkling on the adhesive polymer sheet 12. The small diameter spheres 11, e.g., 1 to 5 mils, are deposited with a high density distribution to effect a highly reliable contact system. Spheres 11, because of their size and distribution, readily form into a monolayer system, and any excesses are removed. Next, the sprinkled sheet 12 is sandwiched between two layers of temporary carrier 13. The assembly is then subject to a thermocompression process using a suitable press. If desired, the assembly may be placed between two TEFLON* or nylon blocks to dis...