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Removal of Quartz Spikes Over Metal Lands

IP.com Disclosure Number: IPCOM000089052D
Original Publication Date: 1977-Sep-01
Included in the Prior Art Database: 2005-Mar-04
Document File: 2 page(s) / 37K

Publishing Venue

IBM

Related People

Colacino, JJ: AUTHOR [+2]

Abstract

During planar quartz deposition, quartz spikes 1 are formed over each metal pattern 2, as shown in Fig. 1. These spikes interfere with the opening of via holes to the metal lands. The spikes are removed by coating the quartz layer 3, which has a thickness of about 23,000-25,000 angstroms, with about 10,000 to 20,000 angstroms of a polymer-containing resist material 4 (Fig. 2), such as the AZ1350J resist marketed by the Shipley Company. The structure is treated with a reactive gas plasma with a gas mixture of, for example, CF(4) and O(2) which will produce an etch rate ratio of about 1/1 between the resist and the quartz. The resist layer 4 is removed along with the spikes 1, as shown in Fig. 3. The via holes are then opened using a patterned resist layer.

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Removal of Quartz Spikes Over Metal Lands

During planar quartz deposition, quartz spikes 1 are formed over each metal pattern 2, as shown in Fig. 1. These spikes interfere with the opening of via holes to the metal lands. The spikes are removed by coating the quartz layer 3, which has a thickness of about 23,000-25,000 angstroms, with about 10,000 to 20,000 angstroms of a polymer-containing resist material 4 (Fig. 2), such as the AZ1350J resist marketed by the Shipley Company. The structure is treated with a reactive gas plasma with a gas mixture of, for example, CF(4) and O(2) which will produce an etch rate ratio of about 1/1 between the resist and the quartz. The resist layer 4 is removed along with the spikes 1, as shown in Fig. 3. The via holes are then opened using a patterned resist layer.

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