Browse Prior Art Database

High Performance Single Chip Module

IP.com Disclosure Number: IPCOM000089084D
Original Publication Date: 1977-Sep-01
Included in the Prior Art Database: 2005-Mar-04
Document File: 2 page(s) / 40K

Publishing Venue

IBM

Related People

Doo, VY: AUTHOR [+2]

Abstract

Shown is an air-cooled module which basically includes a substrate, an overhead ground plane, a piggy-back circuit chip and a metal cap.

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High Performance Single Chip Module

Shown is an air-cooled module which basically includes a substrate, an overhead ground plane, a piggy-back circuit chip and a metal cap.

The substrate is made of glass ceramic or spinel porcelain which is compatible with Si (silicon) in thermal expansion. A ground plane is placed above the fanout signal lines and it maintains an air gap from the lines by means of a TEFLON* spacer. The piggy-back circuit chip is joined to pads on the substrate. Finally, a metal cap is sealed onto the substrate at the periphery. The metal used inside the substrate can be gold or silver for voltage planes and vias, and Pt (platinum) or Pd (palladium) ]or some high temperature metal or alloy for the heater.

The ground plane is made of Fe-Ni alloy (Fe 68.6% - Ni 31.4% or Fe 62.7% - Ni 37.3%), or it can also be made of metallized glass ceramic, same as the substrate material. On the ground plate, strips of insulative film such as TEFLON or polyimide is deposited or painted.

The circuit chip is eutectically bonded onto a blank Si wafer flange which is substantially larger than the chip.

The metal cap is made of high thermoconductive metal, such as Cu, A1 or brass. The gap between the cap and the piggy-back blank Si is filled with thermoconductive grease or oil, ZnO-grease or inert mineral oil.

The pins on the bottom layer of the substrate can be either electrolytically plated through a mask (for short pins to be soldered onto the board) or soldered (b...