Browse Prior Art Database

Deposit of a Preform for Encapsulating Multilayer Ceramic Modules

IP.com Disclosure Number: IPCOM000089102D
Original Publication Date: 1977-Sep-01
Included in the Prior Art Database: 2005-Mar-04
Document File: 2 page(s) / 27K

Publishing Venue

IBM

Related People

Dumaine, G: AUTHOR [+4]

Abstract

A seal ring consisting of a gold-tin preform is used to seal a KOVAR* cap to a ceramic substrate.

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Deposit of a Preform for Encapsulating Multilayer Ceramic Modules

A seal ring consisting of a gold-tin preform is used to seal a KOVAR* cap to a ceramic substrate.

During the same manufacturing step, all pins are bonded to one face of a ceramic substrate and the preform ring is deposited onto the other face. This preform consists of a gold-tin alloy ring deposited onto a molybdenum ring which is itself attached to the substrate. In a further step, the cap is bonded to the preform ring by standard techniques, such as a seam sealing technique.

This process allows a better yield and a higher reliability of the encapsulated modules to be achieved. * Trademark of Westinghouse Electric Corporation.

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