Browse Prior Art Database

Air Cooled Module Heat Dissipation

IP.com Disclosure Number: IPCOM000089104D
Original Publication Date: 1977-Sep-01
Included in the Prior Art Database: 2005-Mar-04
Document File: 2 page(s) / 33K

Publishing Venue

IBM

Related People

Dumaine, G: AUTHOR [+3]

Abstract

Improved heat conductivity and thermal contact between a heat sink 1 and a module 2 is achieved through the use of molybdenum studs 3. Module 2 consists of a multilayer ceramic substrate 4 to which are bonded a number of chips 5 sealed by a cap 6. The module is connected to a substrate 7 such as a printed-circuit card or board through pins 8.

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Air Cooled Module Heat Dissipation

Improved heat conductivity and thermal contact between a heat sink 1 and a module 2 is achieved through the use of molybdenum studs 3. Module 2 consists of a multilayer ceramic substrate 4 to which are bonded a number of chips 5 sealed by a cap 6. The module is connected to a substrate 7 such as a printed-circuit card or board through pins 8.

Studs 3 are inserted into substrate 4 and are embedded therein by brazing or some other conventional technique. Studs 3 are also welded to the heat sink. A film of thermal grease may be deposited between studs 3 and substrate 4 or heat sink 1.

The configuration of the multilayer ceramic substrate enables studs 3 to be positioned very close to chips 5, thereby increasing the dissipation of heat.

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