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Electrodeposition of Nickel Layer With High Purity and Low Stress

IP.com Disclosure Number: IPCOM000089130D
Original Publication Date: 1977-Sep-01
Included in the Prior Art Database: 2005-Mar-04
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Howard, JA: AUTHOR

Abstract

For brazing a cap to a ceramic substrate of a circuit device, the ceramic substrate is given a seal band that has a layer of molybdenum formed on the ceramic and a layer of nickel formed on the molybdenum. The nickel can be electrodeposited from a bath of nickel sulfamate. If stress occurs in the nickel layer, the seal band may crack during brazing.

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Electrodeposition of Nickel Layer With High Purity and Low Stress

For brazing a cap to a ceramic substrate of a circuit device, the ceramic substrate is given a seal band that has a layer of molybdenum formed on the ceramic and a layer of nickel formed on the molybdenum. The nickel can be electrodeposited from a bath of nickel sulfamate. If stress occurs in the nickel layer, the seal band may crack during brazing.

A low stress, high purity nickel film was formed at a high current density of 100 to 135 amperes per square foot. The bath contained sufficient chloride free nickel sulfamate to provide 10 grams of nickel metal per gallon, 3 to 5 grams per gallon of boric acid, and 8 grams per gallon of an anode activator. The anode activator is a salt of bromine or other halogen except chlorine, and it promotes dissolution of the nickel anode to maintain the nickel ion concentration of the bath. The bath was maintained at a pH of 3.2 to 3.6 and a temperature of 53.5 to 55 degrees C. The total of organic species in the bath was maintained under 250 parts per million.

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