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Soft Metal Plating of Sealing Surfaces

IP.com Disclosure Number: IPCOM000089131D
Original Publication Date: 1977-Sep-01
Included in the Prior Art Database: 2005-Mar-04
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Mescia, NC: AUTHOR

Abstract

In order to keep the leak rates of a gas, such as helium, within the required limits, improved sealing techniques were designed. The present design utilizes C- or O-rings sandwiched between two flanges; one flange consisting of aluminum and the other having a plating thereon of gold.

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Soft Metal Plating of Sealing Surfaces

In order to keep the leak rates of a gas, such as helium, within the required limits, improved sealing techniques were designed. The present design utilizes C- or O-rings sandwiched between two flanges; one flange consisting of aluminum and the other having a plating thereon of gold.

The improvement consists of plating the C- or O-rings with lead or indium and also plating the aluminum flange sealing surface with lead or indium by utilizing selective brush-plating techniques. The sealing surface was selectively activated employing an activating solution with reverse current, followed immediately with Selectron neutral nickel approximately 0.1 mil thick to provide a good adhesive for the interface metal. This selective nickel deposit was then plated with lead and/or indium approximately 3 mils thick. The adhesion of the various plated metals was found to be excellent using these techniques.

The sealing surface of the gold-plated flange was selectively plated with lead or indium also.

The plated C- or O-ring when placed between the two surfaces plated as described above provides improved sealing, since both sealing surfaces have soft metal coatings which allow a better seal and provide a considerable reduction of the leak rate of the contained gas.

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