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Preparation of Thin Polyimide Films by Vacuum Deposition

IP.com Disclosure Number: IPCOM000089148D
Original Publication Date: 1977-Sep-01
Included in the Prior Art Database: 2005-Mar-04
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Duran, J: AUTHOR [+2]

Abstract

Polyimide films are currently used as thin dielectric layers for chip insulation and packaging purposes. The methods which are used at present are spin coating and dipping, both relying upon the use of solvents.

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Preparation of Thin Polyimide Films by Vacuum Deposition

Polyimide films are currently used as thin dielectric layers for chip insulation and packaging purposes. The methods which are used at present are spin coating and dipping, both relying upon the use of solvents.

Vapor deposition avoids the use of a solvent.

The starting materials can be: (a) ultra-pure polyamic acid i.e., pyromellitic- acid-dianhydride (PMDA)- 4-4/I/ diamino-diphenyl-ether (DADPE), precipitated from acetonitrile and vacuum dried, or (b) a mixture of the ultra-pure monomer powders of PMDA and DADPE.

The starting material is placed in a vacuum vessel below the sample substrate. The apparatus is evacuated to a pressure of about 10 torr. The sample substrate is then heated to a temperature of about 100 degrees C or slightly above. Subsequently, the nutrient a) or b) is heated to a temperature at which the sublimation begins. The film deposition can be noted by observing the refraction rings which are due to the thin polymer layer.

The film produced will vary in color, depending on its thickness, from clear to light yellow.

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