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Foot Pedal Servo Control of Ultrasonic Bonding Tip

IP.com Disclosure Number: IPCOM000089150D
Original Publication Date: 1977-Sep-01
Included in the Prior Art Database: 2005-Mar-04
Document File: 2 page(s) / 37K

Publishing Venue

IBM

Related People

Glushkoff, CG: AUTHOR

Abstract

The system 1 includes a transducing unit 4 with a horn 5 and a bonding tip 6, all mounted on a beam assembly 7. The beam assembly 7 is pivoted such that the bonding tip 6 clears the wire 2 and the pad 3 under the weight of a plunger 8 of a proportional solenoid 9. An adjustable weight 10 pivots the horn 5 and the bonding tip 6 in a downward direction when the plunger 8 is retracted. The proportional solenoid 9 is controlled by a solenoid control unit 11 actuated by a foot pedal 12 according to the depression steps A, B and C of the pedal 12. The pedal 12 also controls the activation of a bonding control unit 13 to activate the ultrasonic bonding system 1.

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Foot Pedal Servo Control of Ultrasonic Bonding Tip

The system 1 includes a transducing unit 4 with a horn 5 and a bonding tip 6, all mounted on a beam assembly 7. The beam assembly 7 is pivoted such that the bonding tip 6 clears the wire 2 and the pad 3 under the weight of a plunger 8 of a proportional solenoid 9. An adjustable weight 10 pivots the horn 5 and the bonding tip 6 in a downward direction when the plunger 8 is retracted. The proportional solenoid 9 is controlled by a solenoid control unit 11 actuated by a foot pedal 12 according to the depression steps A, B and C of the pedal 12. The pedal 12 also controls the activation of a bonding control unit 13 to activate the ultrasonic bonding system 1.

As the pedal 12 is depressed from range A to B, the plunger 8 moves upward and the bonding tip 6 moves down under the action of the weight 10. Thus, in the pedal travel range from A to B, the bonding tip 6 can be moved up and down, as needed, while the wire 2 is being positioned properly on the circuit pad 3. Beyond range B, the bonding tip 6 comes to rest on the wire 2 and the solenoid plunger 8 lifts off the beam assembly 7.

Depressing the pedal 12 to range C activates the bonding control unit 13 for one bonding cycle. During the bonding cycle, the solenoid control unit 11 keeps the proportional solenoid 9 actuated to hold the plunger 8 off the beam assembly
2. Upon completion of the bonding cycle, control is reestablished in the pedal 12. If during the bondin...