Browse Prior Art Database

Interplanar LSI Structure

IP.com Disclosure Number: IPCOM000089174D
Original Publication Date: 1977-Sep-01
Included in the Prior Art Database: 2005-Mar-04
Document File: 2 page(s) / 58K

Publishing Venue

IBM

Related People

Fang, FF: AUTHOR

Abstract

This article describes a large-scale integrated (LSI) semiconductor device having anisotropically etched via holes therein, such that interplanar connections may be made between similar devices or voltage plane devices utilizing solderball or similar connections in the via hole.

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Interplanar LSI Structure

This article describes a large-scale integrated (LSI) semiconductor device having anisotropically etched via holes therein, such that interplanar connections may be made between similar devices or voltage plane devices utilizing solderball or similar connections in the via hole.

Fig. 1 illustrates a silicon substrate 2 which has a via hole 4, bounded by <111> planes, anisotropically etched therein. A field-effect transistor (FET) structure is formed thereon including gate electrodes 6 and 8, source electrodes 10 and 12, and drain electrodes 14 and 16, which are electrically connected to the opposite side of the wafer by conductive walls 18 and 20, respectively, which may be connected to other devices by means of a solderball connection 22. The device may be of a floating source (or drain) FET structure whose source is floating on the opposite side of the wafer, with the floating electrodes being used to contact a similar structure, for example by a solderball connection, as illustrated.

As illustrated in Fig. 2, the technique of anisotropically etching a via hole in a silicon substrate is used to produce an FET structure, including a matrix address electrolyte system such as a viologen electrochromic display panel. In this instance, the pentrahedral via hole is etched only partially through the wafer so that the electronic circuitry is completely sealed from the electrolyte. The electrolyte 23 is formed on one surface of the silicon subs...