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Adhesion Promoter for Additive Photoresists

IP.com Disclosure Number: IPCOM000089232D
Original Publication Date: 1977-Oct-01
Included in the Prior Art Database: 2005-Mar-04
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Mesley, NN: AUTHOR

Abstract

In certain printed circuit (PC) manufacturing processes, photoresists (PR) have a tendency not to adhere to the copper of the PC board when the latter is subjected to an associated additive plating bath.

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Adhesion Promoter for Additive Photoresists

In certain printed circuit (PC) manufacturing processes, photoresists (PR) have a tendency not to adhere to the copper of the PC board when the latter is subjected to an associated additive plating bath.

To enhance the adhesion of the liquid PR to the copper of the PC board being processed, an adhesion promoter such as ENTEK CU-56* can be used when the board is placed in the highly caustic additive bath for a long period of time. * Manufactured by Enthone, Inc.

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