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Electroplating Process for Forming Heavy Gold Plating on Multilayer Ceramic Substrates

IP.com Disclosure Number: IPCOM000089241D
Original Publication Date: 1977-Oct-01
Included in the Prior Art Database: 2005-Mar-04
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Loehndorf, D: AUTHOR

Abstract

Sophisticated multilayer ceramic integrated circuit packages can contain, on the same surface, solder pad terminals for attachment to integrated circuit devices and heavy gold pads for making engineering changes and also for correcting internal substrate defects. The changes are made by thermal-compression-bonding wires to the appropriate pads forming interconnections. The heavy gold must be deposited by electroplating. The pads, prior to electroplating, must be commoned by forming a conductive layer over the solder pads, which will ultimately be joined to the devices.

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Electroplating Process for Forming Heavy Gold Plating on Multilayer Ceramic Substrates

Sophisticated multilayer ceramic integrated circuit packages can contain, on the same surface, solder pad terminals for attachment to integrated circuit devices and heavy gold pads for making engineering changes and also for correcting internal substrate defects. The changes are made by thermal- compression-bonding wires to the appropriate pads forming interconnections. The heavy gold must be deposited by electroplating. The pads, prior to electroplating, must be commoned by forming a conductive layer over the solder pads, which will ultimately be joined to the devices.

In this process for forming heavy gold contact terminals on a substrate having internal circuitry which interconnects device contact pads and error-correction- contact terminals, a layer of solder is deposited over the device contact pad area. The pads in this area have previously been defined by a solder-wettable material, deposited over the layer of solder, and the exposed error-correction-pad portion of the multilayer ceramic substrate is then exposed to an electroplating bath. In this bath a thick layer of gold is selectively plated over the error-correction- contact terminals. Following the electroplating step, the dielectric layer is removed from the solder layer, and the device is heated above the melting point of the solder. During the heating step the solder reforms over the device contact pads.

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