Browse Prior Art Database

Thermally Enhanced Module for Self Contained Data Processing Package

IP.com Disclosure Number: IPCOM000089258D
Original Publication Date: 1977-Oct-01
Included in the Prior Art Database: 2005-Mar-04
Document File: 2 page(s) / 54K

Publishing Venue

IBM

Related People

Arnold, AJ: AUTHOR [+2]

Abstract

Fig. 1 and View A thereof illustrate a structure designed to promote cooling of an integrated circuit assembly. This is accomplished by fitting a cap, suitably configured as a heat sink, over the chip-joined substrate in such a manner that an efficient medium for heat transfer is retained in the minimal gaps separating the backs of the chips from the ceiling of the cap interior.

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Thermally Enhanced Module for Self Contained Data Processing Package

Fig. 1 and View A thereof illustrate a structure designed to promote cooling of an integrated circuit assembly. This is accomplished by fitting a cap, suitably configured as a heat sink, over the chip-joined substrate in such a manner that an efficient medium for heat transfer is retained in the minimal gaps separating the backs of the chips from the ceiling of the cap interior.

To obtain effective performance, the interior of the cap is fabricated to close tolerance and partitioned by walls running between the chips. These walls serve both as supports to prevent deflection and as conductors to draw off heat.

Partitioning of the cap permits a predetermined volume of a substance, such as silica gel, to be dispensed into each individual compartment (with the cap inverted). Bringing the substrate (likewise inverted) against the cap then causes the chips to submerge in and displace the substance in each of their respective cavities. With the substrate held firmly against the cap, the two are bonded together and the substance cured to create an immobile, yet pliant, intermediate layer between chip and cap. The assembly may now be brought into any orientation desired for operation without disturbing the thermal withdrawal path.

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