Browse Prior Art Database

Semiconductor Module With Improved Air Cooling

IP.com Disclosure Number: IPCOM000089259D
Original Publication Date: 1977-Oct-01
Included in the Prior Art Database: 2005-Mar-04
Document File: 2 page(s) / 44K

Publishing Venue

IBM

Related People

Zirnis, EE: AUTHOR

Abstract

The drawing shows a ceramic substrate 1 having pins 2. A semiconductor chip 4 is connected to conductive lines 6 on the substrate by solder balls 5. A metal cap 7, preferably aluminum, is hermetically sealed to the substrate. For cooling chip 4, heat is transferred through the solder balls and thermally conductive material 8, such as SYLGARD*, to the substrate.

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Semiconductor Module With Improved Air Cooling

The drawing shows a ceramic substrate 1 having pins 2. A semiconductor chip 4 is connected to conductive lines 6 on the substrate by solder balls 5. A metal cap 7, preferably aluminum, is hermetically sealed to the substrate. For cooling chip 4, heat is transferred through the solder balls and thermally conductive material 8, such as SYLGARD*, to the substrate.

The module also includes a flexible thermal bridge 9, extending between the cap and the electrical backside surface of the chip. The bridge is preferably fabricated from beryllium copper foil and suitably bonded (not shown) to the backside of the chip. The thermal bridge provides improved heat transfer from the chip to the metal cap. * Trademark of Dow Corning Corporation.

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