Browse Prior Art Database

Conductor Plating System

IP.com Disclosure Number: IPCOM000089280D
Original Publication Date: 1977-Oct-01
Included in the Prior Art Database: 2005-Mar-04
Document File: 1 page(s) / 12K

Publishing Venue

IBM

Related People

Peekema, RM: AUTHOR

Abstract

In gaseous discharge display devices, parallel conductor arrays, formed on glass substrates and overcoated with a layer of dielectric, are positioned orthogonal to each other, and individual cells located at the intersection of the respective conductors are selectively energized by appropriate drive signals to produce a visible light output. One prior metallurgy system for the conductor arrays comprises a three layer system including a layer of copper conductor with an underlayer of chrome to provide adhesion to the glass and an overlayer of chrome to protect the copper from attack by the active glass frit during reflow of the dielectric.

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Conductor Plating System

In gaseous discharge display devices, parallel conductor arrays, formed on glass substrates and overcoated with a layer of dielectric, are positioned orthogonal to each other, and individual cells located at the intersection of the respective conductors are selectively energized by appropriate drive signals to produce a visible light output. One prior metallurgy system for the conductor arrays comprises a three layer system including a layer of copper conductor with an underlayer of chrome to provide adhesion to the glass and an overlayer of chrome to protect the copper from attack by the active glass frit during reflow of the dielectric.

In a system of the above-described type, the edges of the copper are not protected against attack by the dielectric glass, and it has been proposed to plate the copper with a metal, such as nickel, to provide complete protection to the entire conductor. However, it has been determined that nickel does not adhere well to copper, and an intermediate layer of palladium formed over the copper prior to the nickel plating step is used to improve the adhesion of the nickel to the copper. However, using the normal hydrochloric acid bath for immersion plating of palladium on copper provided both poor adhesion and a porous coating as well as a slow plating rate.

By modifying the acid bath from hydrochloric to sulfuric acid, the poor adhesion and porous coating were eliminated, and better adherence of the nickel pl...