Browse Prior Art Database

Module Stand Off Concept

IP.com Disclosure Number: IPCOM000089292D
Original Publication Date: 1977-Oct-01
Included in the Prior Art Database: 2005-Mar-04
Document File: 2 page(s) / 30K

Publishing Venue

IBM

Related People

Horbert, TA: AUTHOR [+3]

Abstract

Fig. 1 shows a conventional circuit board 3 and a ceramic wafer 4 that is mounted on the board by pin 5. The pin, located in a hole 6 in the board, mechanically supports the wafer and provides electrical connection between electrical components on the wafer and printed electrical wiring on the board. The wafer and board are assembled as shown in Fig. 1, and passed over a solder wave to solder the pin to the electrical wiring on the board.

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Module Stand Off Concept

Fig. 1 shows a conventional circuit board 3 and a ceramic wafer 4 that is mounted on the board by pin 5. The pin, located in a hole 6 in the board, mechanically supports the wafer and provides electrical connection between electrical components on the wafer and printed electrical wiring on the board. The wafer and board are assembled as shown in Fig. 1, and passed over a solder wave to solder the pin to the electrical wiring on the board.

A stand-off device 8, also shown in a top view in Fig. 2, is attached to the pin to space the wafer from the board for soldering. The stand-off device is made of metal and is constructed for an interference fit with a pin 5. The stand-off device is located on the pin after the pin is connected to the wafer. The pin and the stand-off device are then pretinned.

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