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Ink Jet Charge Plate Fabrication

IP.com Disclosure Number: IPCOM000089349D
Original Publication Date: 1977-Oct-01
Included in the Prior Art Database: 2005-Mar-04
Document File: 2 page(s) / 50K

Publishing Venue

IBM

Related People

Nickols, SE: AUTHOR [+2]

Abstract

A technique to fabricate an ink jet charge plate is described. The charge plate is formed by producing slots 12 in a suitable substrate 10 and forming a pattern of conductor paths 16 by using zero flow screenable organic compound 14 on the conductor side of the substrate as well as on the back side of the substrate. A conductive paste is then screened on the front surface of the charge plate to produce conductor pattern 18 on the surface of the substrate as well as conductive areas within slots 12. The charge plate is then passed through a firing cycle so that the remainder of the organic compound 14 is burned out at the same time that the conductive paste is hardened to produce the conductive patterns in the slots 12 as well as the conductors 18 leading up to the slots.

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Ink Jet Charge Plate Fabrication

A technique to fabricate an ink jet charge plate is described. The charge plate is formed by producing slots 12 in a suitable substrate 10 and forming a pattern of conductor paths 16 by using zero flow screenable organic compound 14 on the conductor side of the substrate as well as on the back side of the substrate. A conductive paste is then screened on the front surface of the charge plate to produce conductor pattern 18 on the surface of the substrate as well as conductive areas within slots 12. The charge plate is then passed through a firing cycle so that the remainder of the organic compound 14 is burned out at the same time that the conductive paste is hardened to produce the conductive patterns in the slots 12 as well as the conductors 18 leading up to the slots.

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