Browse Prior Art Database

Method of Reworking Sealed Modules

IP.com Disclosure Number: IPCOM000089357D
Original Publication Date: 1977-Jul-01
Included in the Prior Art Database: 2005-Mar-04
Document File: 2 page(s) / 38K

Publishing Venue

IBM

Related People

Pottier, B: AUTHOR

Abstract

The module comprises a ceramic substrate on whose surfaces are mounted pins and chips. A KOVAR* ring spacer is placed around the chips and brazed onto the substrate using Au-Sn solder. A KOVAR cap, which exhibits a recessed central portion, is then welded onto the spacer (Fig. 1). To gain access to the chips, all that is required is to remove that portion of the cap which is located over the spacer by moans of a cutting or lapping operation (Fig. 2), and then to remove the recessed portion of the cap which provided protection for the chips during said operation. When the required repairs have been completed, a new cap is welded onto the spacer. This process can be repeated several times on the same module. * Trademark of Westinghouse Electric Corp.

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Method of Reworking Sealed Modules

The module comprises a ceramic substrate on whose surfaces are mounted pins and chips. A KOVAR* ring spacer is placed around the chips and brazed onto the substrate using Au-Sn solder. A KOVAR cap, which exhibits a recessed central portion, is then welded onto the spacer (Fig. 1). To gain access to the chips, all that is required is to remove that portion of the cap which is located over the spacer by moans of a cutting or lapping operation (Fig. 2), and then to remove the recessed portion of the cap which provided protection for the chips during said operation. When the required repairs have been completed, a new cap is welded onto the spacer. This process can be repeated several times on the same module. * Trademark of Westinghouse Electric Corp.

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