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Auger Registration Technique for X Ray Lithography

IP.com Disclosure Number: IPCOM000089390D
Original Publication Date: 1977-Oct-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 1 page(s) / 12K

Publishing Venue

IBM

Related People

Kirkpatrick, S: AUTHOR [+2]

Abstract

A sensitive alignment technique is provided for registering a mask with respect to a substrate for X-ray lithography at submicron resolution. Auger electron emission is used to permit strong discrimination of a registration spot from other wafer materials.

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Auger Registration Technique for X Ray Lithography

A sensitive alignment technique is provided for registering a mask with respect to a substrate for X-ray lithography at submicron resolution. Auger electron emission is used to permit strong discrimination of a registration spot from other wafer materials.

In order to align the mask correctly with the wafer/substrate for submicron X- ray lithography, a small region or pattern of material, e.g., a metal, composed of different elements from those in the substrate, is deposited on the substrate as an Auger source for registration. A corresponding hole in the mask permits X- rays to strike the Auger source only when proper registration is obtained. A pattern of two perpendicular Auger source-lines and mask holes is used. Auger electrons, which have kinetic energies characteristic of the Auger source elements, are emitted from the Auger source only when it is struck by X-rays, i.e., only when proper alignment is achieved. These Auger electrons are detected by collecting all or part of them on a metallic detector which is produced on the back side of the mask near the alignment hole and is electrically isolated from it. If the X-ray mask is made of metal on the wafer side of the mask, a suitable portion electrically isolated from the rest of the mask could be used as the Auger electron collector.

Since the X-rays produce direct photoelectrons and Auger electrons from both the Auger source and from the photoresist, the...