Browse Prior Art Database

Alignable Conformable Contact Printer

IP.com Disclosure Number: IPCOM000089401D
Original Publication Date: 1977-Oct-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 81K

Publishing Venue

IBM

Related People

Lapadula, C: AUTHOR [+2]

Abstract

A wafer and mask are aligned with respect to each other and brought into contact before vacuum and positive pressure are used to enhance contact for conformable contact printing in multilayer integrated circuit fabrication.

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Alignable Conformable Contact Printer

A wafer and mask are aligned with respect to each other and brought into contact before vacuum and positive pressure are used to enhance contact for conformable contact printing in multilayer integrated circuit fabrication.

A platform 10 (Fig. 1) supports a conformable element 12, such as a wafer, for alignment with respect to a rigid element 14, such as a mask, supported by holder 16. Wafer 12 is urged toward platform 10 and mask 14 is urged toward holder 16 by applying vacuum pressure to ports 18 and 20, respectively. A diaphragm 22 rests between wafer 12 and platform 10 and extends beyond the periphery of wafer 12. Perpendicular channels 24 in platform 10 bring the vacuum pressure from port 18 to apertures 26 in diaphragm 22, thereby securely holding wafer 12 against diaphragm 22 and platform 10.

Platform 10 and holder 16 may be translated with respect to each other in all three dimensions, and may be rotated with respect to each other in the plane of the wafer. The wafer 12 and mask 14 are aligned with respect to each other out of contact by moving platform 10 with respect to holder 16. The wafer and mask are then brought into contact with each other, and thereafter vacuum pressure is gradually switched from port 18 to port 28. The edge of diaphragm 22 is drawn up by the air flow resulting from the vacuum pressure until it seals against holder
16. A spacer rim 29, having a channel 30 to the interior thereof and a thickness of about two-thirds the normal wafer thickness, is positioned adjacent to the inner port 32 so that vacuum pressure applied to port 28 is not block...