Browse Prior Art Database

Field Reworkable Chip System

IP.com Disclosure Number: IPCOM000089460D
Original Publication Date: 1977-Nov-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 43K

Publishing Venue

IBM

Related People

Ferraro, AJ: AUTHOR [+2]

Abstract

A field reworkable chip system includes a pressure attachment mechanism to provide both an environmental seal and an electrical contact between a decal frame and the circuit carrier. Using thermal enhancement to help dissipate excess heat, the system establishes a location from the carrier circuitry to the chip pads via the decal ribbon where the ribbon becomes the registration mechanism to the cap, which is in the connector block containing the carrier.

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Field Reworkable Chip System

A field reworkable chip system includes a pressure attachment mechanism to provide both an environmental seal and an electrical contact between a decal frame and the circuit carrier. Using thermal enhancement to help dissipate excess heat, the system establishes a location from the carrier circuitry to the chip pads via the decal ribbon where the ribbon becomes the registration mechanism to the cap, which is in the connector block containing the carrier.

Using this concept, various types of chips can be used since the chips are joined to the decal via standard techniques, with the decal lead being exposed at one end, as shown in Fig. 1. The exposed decal leads can contain gold or other precious metals to provide improved contact resistance characteristics, and the decal is located near a rubber gasket or seal, as shown. The seal is fit to the cap, and can be cemented on the inner edge of the cap.

Once the decal with the chip thereon is located appropriately on the interconnection device, the cap is placed thereover, and a spring-loaded screw is used to apply the force necessary to seal the device, as illustrated in Fig. 2. The pressure applied also provides the interconnection between the decal frame and the circuit, the pressure applied being only that necessary to provide a good electrical connection.

Using this technique, a field repair engineer need only carry the cap-decal- chip for replacement parts, since rework does not requir...