Browse Prior Art Database

Improving Bonding Strength of Polyimide To Silicon Wafers

IP.com Disclosure Number: IPCOM000089461D
Original Publication Date: 1977-Nov-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Sacher, E: AUTHOR [+2]

Abstract

It is well-known that the treatment of a surface with a silane ester can improve the adhesion of materials to the surface. For example, the treatment of a silicon wafer with silane can improve the adhesion of polyimide coatings to the silicon wafer. Normally, concentrations in the range between .01% to 0.1% of silane are utilized.

This text was extracted from a PDF file.
This is the abbreviated version, containing approximately 100% of the total text.

Page 1 of 1

Improving Bonding Strength of Polyimide To Silicon Wafers

It is well-known that the treatment of a surface with a silane ester can improve the adhesion of materials to the surface. For example, the treatment of a silicon wafer with silane can improve the adhesion of polyimide coatings to the silicon wafer. Normally, concentrations in the range between .01% to 0.1% of silane are utilized.

It has been found that by increasing the concentration of silane to 1%, the adhesion of polyimide to a silicon wafer can be greatly enhanced.

1