Browse Prior Art Database

Contamination Free Wafer Transfer Mechanism

IP.com Disclosure Number: IPCOM000089486D
Original Publication Date: 1977-Nov-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 46K

Publishing Venue

IBM

Related People

Mueller, WF: AUTHOR

Abstract

In the fabrication of large-scale integrated circuits of ever-increasing device density. contamination during fabrication by ambient dust has presented a problem. It is desirable to transfer a wafer from one processing station to another by a readily accessible device which is fully and easily sealable from the ambient.

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Contamination Free Wafer Transfer Mechanism

In the fabrication of large-scale integrated circuits of ever-increasing device density. contamination during fabrication by ambient dust has presented a problem. It is desirable to transfer a wafer from one processing station to another by a readily accessible device which is fully and easily sealable from the ambient.

The basic wafer carrier is shown in Fig. 1, and the improved backside wafer seal is shown in Figs. 2 and 3. The workpiece 1, which may be a semiconductor wafer or a mask used in semiconductor processing, is placed on an 0-ring 2 resting in groove 3 of wafer carrier substrate 4. In order to ensure that chamber 8 above the wafer will be free of dust and other ambient contaminants, a cover 5 is placed onto carrier substrate 4 and makes a substantially airtight engagement with 0-ring 11. Then by means of screw member 6, cover 5 is screwed down until pressure gauge 7 shows a pressure differential between cavity 8 and the atmospheric pressure maintained on the backside of wafer 1 through conduit 9. However, since wafer 1 and 0-ring 2, which engage, are seldom perfectly flat, vacuum grease must be applied between 0-ring 2 and wafer 1 in order to achieve an airtight seal.

Seal member 10 (Figs. 2 and 3), which is proposed in place of 0-ring 2, will ensure a perfect seal between the backside 12 of the wafer and the seal member 10 without the use of vacuum grease. The elimination of vacuum grease is desirable since...