Browse Prior Art Database

Thermal Conduction Module

IP.com Disclosure Number: IPCOM000089495D
Original Publication Date: 1977-Nov-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 52K

Publishing Venue

IBM

Related People

Dombroski, EL: AUTHOR [+3]

Abstract

A conduction module design is shown in Figs. 1 and 2 wherein preformed sheets of aluminum foil 4, nested together, form an array of contact surfaces to mate with the individual chip surfaces 5. The chip 5 is attached to substrate 9. The plan view of the outer foil making contact with the chip surfaces is shown in Fig. 2. The design concept provides a means wherein substrate distortion, chip irregularities, etc., can be accommodated to form a complete surface contact for conduction heat transfer.

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Thermal Conduction Module

A conduction module design is shown in Figs. 1 and 2 wherein preformed sheets of aluminum foil 4, nested together, form an array of contact surfaces to mate with the individual chip surfaces 5. The chip 5 is attached to substrate 9. The plan view of the outer foil making contact with the chip surfaces is shown in Fig. 2. The design concept provides a means wherein substrate distortion, chip irregularities, etc., can be accommodated to form a complete surface contact for conduction heat transfer.

The formed foil sheets will be of a sufficient number to provide the necessary cross-sectional area for the heat conduction path. The sheets are also designed such that bending and buckling loads are the reaction forces to minimize contact resistance. The outer formed sheet 6 is anodized since electrical potential differences can exist between chips. An aluminum stiffening sheet 7 is at the top and bottom of the foil sheets. The assembly is then fixed to the module housing 8, which will have circulating water for heat rejection.

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