Browse Prior Art Database

Heat Transfer Chip

IP.com Disclosure Number: IPCOM000089496D
Original Publication Date: 1977-Nov-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 45K

Publishing Venue

IBM

Related People

Ostergren, CD: AUTHOR

Abstract

The illustrated bimetallic heat transfer chip allows the semiconductor devices to be kept at a relatively constant temperature compared to one another. Semiconductor devices are connected to substrate 2 by solder joints 3. A bimetallic chip 4 is attached to the backside of each of the devices 1. The chip 4 is held to a cold plate 5 by a spring 6. The cold plate 5 may contain running water to aid in the removal of heat.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 100% of the total text.

Page 1 of 2

Heat Transfer Chip

The illustrated bimetallic heat transfer chip allows the semiconductor devices to be kept at a relatively constant temperature compared to one another. Semiconductor devices are connected to substrate 2 by solder joints 3. A bimetallic chip 4 is attached to the backside of each of the devices 1. The chip 4 is held to a cold plate 5 by a spring 6. The cold plate 5 may contain running water to aid in the removal of heat.

As the device 1 heats up, the chip 4 sides straighten and the back of the chip contacts the cold plate 5. This act increases the heat transfer from the device 1 to the cold plate 5. When the device 1 cools, the chip 4 breaks contact with the cold plate 5.

1

Page 2 of 2

2

[This page contains 3 pictures or other non-text objects]