Browse Prior Art Database

Slip On Standoff for Semiconductor Modules

IP.com Disclosure Number: IPCOM000089497D
Original Publication Date: 1977-Nov-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 27K

Publishing Venue

IBM

Related People

Arnold, AJ: AUTHOR

Abstract

Disclosed is a slip-on standoff designed for attachment to hermetically sealed semiconductor modules. The standoff is molded or cast from impact and heat resistant plastic. The standoff is "toed in" slightly at its open end to create a gripping effect on the substrate of the semiconductor module.

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Slip On Standoff for Semiconductor Modules

Disclosed is a slip-on standoff designed for attachment to hermetically sealed semiconductor modules. The standoff is molded or cast from impact and heat resistant plastic. The standoff is "toed in" slightly at its open end to create a gripping effect on the substrate of the semiconductor module.

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