Browse Prior Art Database

Dendrite Conduction Module

IP.com Disclosure Number: IPCOM000089498D
Original Publication Date: 1977-Nov-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 29K

Publishing Venue

IBM

Related People

Oktay, S: AUTHOR [+2]

Abstract

Dendrites are effectively providing a large increase in surface area which can be used for all modes of heat transfer, i.e., convection, boiling, conduction, etc.

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Dendrite Conduction Module

Dendrites are effectively providing a large increase in surface area which can be used for all modes of heat transfer, i.e., convection, boiling, conduction, etc.

A spherical tip piston 4, to obtain the larger surface contact area, is in contact with a chip surface 5 populated with dendrites 6, as shown in the figure. The chip is carried upon substrate 7. The dendrites are populated such that a cushion pad is formed. When the piston comes in contact with the dendrites, the dendrites will deform and displace, forming contact with the semi-spheric surface. This approach has the following advantages: 1) Large surface interface area, resulting in low thermal resistance. 2) Power/chip capabilities in excess of 10 watts. 3) Conduction cooling without the use of supplementary fluids to replace air in module. 4) Chip can be tested in a fluorocarbon bath prior to use.

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