Browse Prior Art Database

Crosshatched Reference Plane

IP.com Disclosure Number: IPCOM000089502D
Original Publication Date: 1977-Nov-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 51K

Publishing Venue

IBM

Related People

Crowder, G: AUTHOR [+3]

Abstract

In multilayer packaging structures the interconnection of the high density integrated circuit chips requires a large number of vias for signal lines and power distribution. This results in the reference planes being "chopped" up by the via clearance holes. Thus, a "solid" reference plane is no longer solid. Some areas may be without a reference plane and near isolated islands, causing discontinuities in transmission line parameters. The use of a crosshatched reference plane will provide a more uniform reference throughout the entire package.

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Crosshatched Reference Plane

In multilayer packaging structures the interconnection of the high density integrated circuit chips requires a large number of vias for signal lines and power distribution. This results in the reference planes being "chopped" up by the via clearance holes. Thus, a "solid" reference plane is no longer solid. Some areas may be without a reference plane and near isolated islands, causing discontinuities in transmission line parameters. The use of a crosshatched reference plane will provide a more uniform reference throughout the entire package.

Fig. 1 is a cross-sectional view (line 1-1, Fig. 2) of a multilayer package. Fig. 2 is a top view of a crosshatched reference plane.

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