Browse Prior Art Database

Reducing Spatter in Copper Evaporation Processing of Gas Display Panels

IP.com Disclosure Number: IPCOM000089510D
Original Publication Date: 1977-Nov-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Grivjack, S: AUTHOR [+3]

Abstract

In evaporation of copper as carried out in the production of gas display panels, problems have occurred in that substrates are bombarded with copper spatter created by contact with the electron-beam gun in the crucible. Spatter on the substrates results in product defect in later processing sectors, such as photolithography, line width inspection, reflow and final testing.

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Reducing Spatter in Copper Evaporation Processing of Gas Display Panels

In evaporation of copper as carried out in the production of gas display panels, problems have occurred in that substrates are bombarded with copper spatter created by contact with the electron-beam gun in the crucible. Spatter on the substrates results in product defect in later processing sectors, such as photolithography, line width inspection, reflow and final testing.

It has been recognized that these spatter problems can be largely controlled through the use of extremely clean copper slugs. The cleaning of the slugs is preferably accomplished by an etching process or by a hydrogen firing process prior to their placement in the electron-beam crucible.

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