Browse Prior Art Database

Semiconductor Chip Structure

IP.com Disclosure Number: IPCOM000089551D
Original Publication Date: 1977-Nov-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 37K

Publishing Venue

IBM

Related People

DiGiacomo, G: AUTHOR

Abstract

When manufacturing semiconductor chips that will be joined, by soldering, to a module, solder wettability at the points of joinder is of great importance.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 100% of the total text.

Page 1 of 2

Semiconductor Chip Structure

When manufacturing semiconductor chips that will be joined, by soldering, to a module, solder wettability at the points of joinder is of great importance.

The structure shown above has very good solder wettability. After molybdenum is put into the via hole, about 3 microns of nickel is electrotrolessly deposited, followed by electroless deposition of 1 to 2 microns of copper. The assembly is then sintered at 680 Degrees C to 750 Degrees C.

1

Page 2 of 2

2

[This page contains 1 picture or other non-text object]