Browse Prior Art Database

Gaseous Bearing Transport Control within Thermal Controlled Environment

IP.com Disclosure Number: IPCOM000089554D
Original Publication Date: 1977-Nov-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 93K

Publishing Venue

IBM

Related People

Gruber, LW: AUTHOR [+2]

Abstract

A track network system similar to the wafer transport system is fabricated as shown in Figs. 1 and 2 to transport modules and similar products through the solder-reflow joining process. This contamination free system can be installed in conjunction with the existing chip placement tools. The entire system is run from a fluidic logic control, or IBM/ System 7 or a combination of both. All the pallets must be of the same size and of sufficient dimension to allow for various size module loading. Pyro panel infrared heaters are utilized in place of the usual furnaces which can be programmed for any time/temperature cycle in a matter of seconds. No long cool-down or heat-up cycles are required.

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Gaseous Bearing Transport Control within Thermal Controlled Environment

A track network system similar to the wafer transport system is fabricated as shown in Figs. 1 and 2 to transport modules and similar products through the solder-reflow joining process. This contamination free system can be installed in conjunction with the existing chip placement tools. The entire system is run from a fluidic logic control, or IBM/ System 7 or a combination of both. All the pallets must be of the same size and of sufficient dimension to allow for various size module loading. Pyro panel infrared heaters are utilized in place of the usual furnaces which can be programmed for any time/temperature cycle in a matter of seconds. No long cool-down or heat-up cycles are required.

Depending on the thermal demands of the track 10, the thermal gradients of the modules on the pallet 1 (Fig. 1) can be maintained by the ported air at openings, 8, 9 and 11. The air is supplied from the thermocouple 12 controlled hot gas units 13.

The air/gas to preheat and move the pallets 1 for the solder-reflow operation can be pure nitrogen, forming gas, filtered air or any combination of gases. The length of the infrared radiant heaters 15 and the temperature profile are dependent on the mass and number of modules on the pallet 1. Accordingly, the preheat, solder reflow and cooling cycles can be easily controlled. Most of the process can be viewed through high temperature transparent covers 14 which en...