Browse Prior Art Database

Cooling of a Module with Stud Mounted Cold Plate

IP.com Disclosure Number: IPCOM000089558D
Original Publication Date: 1977-Nov-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 52K

Publishing Venue

IBM

Related People

Balderes, D: AUTHOR [+3]

Abstract

This arrangement provides a closed, water-cooled system for cooling multichip modules.

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Cooling of a Module with Stud Mounted Cold Plate

This arrangement provides a closed, water-cooled system for cooling multichip modules.

Fig. 1 shows the layout of the module having a stud-mounted cold plate 10. Fig. 2 is a cross-sectional view taken along the line 2-2 of Fig. 1. This figure shows a module having a number of chips which are mounted on a substrate 12 which contains edge connectors 14 mounted to a board 16. The chips are solder-ball connected to one side of the substrate 12. These chips are covered with a KOVAR* cap 18 which is also assembled to the same side of the substrate. KOVAR studs 20 are brazed to metallized pads 22 on the opposite side of the substrate 12. A segmented copper cold plate 10 with thru holes 24 is mounted to the stud 20 with spring washers 26 and nuts 28. The spring washers 26 keep a controlled force between the cold plate 10 and the studs 20 to maintain low thermal resistance at their contact surfaces. The cold plate 10 is segmented to channel the liquid, such as water, serially past each stud 20, as indicated by the arrows in Fig. 1, and to allow for cold plate deflection when conforming to the stud surfaces without inducing stresses in the substrate 12. The cooling fluid is brought into each cold plate 10 through hoses from a cooling bus (not shown).

The heat transfer path is from the front side of the chip and extends through the solder balls, the substrate 12, the stud 20 head and cold plate 10 to the cooling liquid. This...