Browse Prior Art Database

Circuit Module with Self Aligning Heat Transfer

IP.com Disclosure Number: IPCOM000089559D
Original Publication Date: 1977-Nov-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 40K

Publishing Venue

IBM

Related People

Nuccio, C: AUTHOR [+2]

Abstract

The drawing shows a conventional semiconductor chip 2 that is electrically and mechanically connected to a ceramic wafer 3 by solder balls 4. The solder ball connection also provides heat transfer from the chip to the wafer for cooling the chip. An improved heat transfer path from the chip is provided by parts 6, 7 and 8. Part 8 is a thin metal structure that is mounted in a fixed position with respect to the ceramic wafer 3 and may be connected to an outer enclosure 9 in a heat transferring relationship. Part 8 may be made of aluminum. Part 7, which may be made of copper, has an upper portion 7a that is shaped to be connected to part 8 by a press fit. Part 6 is made of a spring material, such as beryllium copper, which has good heat conductivity.

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Circuit Module with Self Aligning Heat Transfer

The drawing shows a conventional semiconductor chip 2 that is electrically and mechanically connected to a ceramic wafer 3 by solder balls 4. The solder ball connection also provides heat transfer from the chip to the wafer for cooling the chip. An improved heat transfer path from the chip is provided by parts 6, 7 and 8. Part 8 is a thin metal structure that is mounted in a fixed position with respect to the ceramic wafer 3 and may be connected to an outer enclosure 9 in a heat transferring relationship. Part 8 may be made of aluminum. Part 7, which may be made of copper, has an upper portion 7a that is shaped to be connected to part 8 by a press fit. Part 6 is made of a spring material, such as beryllium copper, which has good heat conductivity. It has a flat lower surface that fits against the upper surface of chip 2, and has spring fingers that extend upwardly and outwardly to engage the lower portion 7b of part 7. The spring action of part 6 provides good contact between part 6 and part 7, and between part 6 and chip
2. The lower portion 7b of part 7 has a rounded shape to permit part 6 to adjust to a position connecting the chip to part 7.

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