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Thermal Enhancement Technique for Large Scale Integrated Circuit Chip Carriers

IP.com Disclosure Number: IPCOM000089683D
Original Publication Date: 1977-Dec-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 34K

Publishing Venue

IBM

Related People

Spaight, RN: AUTHOR

Abstract

This technique for providing significant thermal enhancement for large-scale integration (LSI) modules utilizes the combination of a slidably mounted stud in the cap of the module, together with a formable thermal transfer media, such as thermal grease.

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Thermal Enhancement Technique for Large Scale Integrated Circuit Chip Carriers

This technique for providing significant thermal enhancement for large-scale integration (LSI) modules utilizes the combination of a slidably mounted stud in the cap of the module, together with a formable thermal transfer media, such as thermal grease.

Referring to the figure, a stud 11 is mounted in a cap 13 and secured thereto by a solder ring 15 or other appropriate sealing material. A thermally conducting fluid media, such as thermal grease 17, is placed between the bottom of the stud 11 and the top of a circuit module 19. The chip is connected via solder balls 21 to the chip carrier 23 having suitable I/O connections. The thermally conducting fluid media 17 between the stud and the chip surface may be unenclosed or could be enclosed in a thin film, pillow-like material.

Alternatively, the thermally conductive fluid media could surround the stud and be enclosed by a suitable membrane secured to the cap, which membrane would come into contact with the top of the circuit chip. Still another approach would be to enclose the chip, including the solder ball connections 21, in a thermally conductive media and contain the thermally conductive media by a suitable membrane, which would then contact the base of the stud 11.

Using this combination, a minimal spacing of the thermally conductive fluid media is maintained to maximize the thermal transfer characteristics, while at the same time...