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Browse Prior Art Database

Automated Pin Assembly System

IP.com Disclosure Number: IPCOM000089685D
Original Publication Date: 1977-Dec-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 3 page(s) / 46K

Publishing Venue

IBM

Related People

House, LD: AUTHOR [+2]

Abstract

This system assembles a high density array of pins to module substrates and the like, each substrate having previously been provided with a corresponding array of pin-receiving openings therethrough.

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Automated Pin Assembly System

This system assembles a high density array of pins to module substrates and the like, each substrate having previously been provided with a corresponding array of pin-receiving openings therethrough.

Substrates S are preloaded into a channel-shaped carrying tray T. One or more trays T are vertically stacked on the inclined faceplate F of the conveying system frame 1 assembly of indexing station (STA.) 1. A horizontal window W is provided in faceplate F, through which project the teeth of a toothed conveying belt B1. The undersurface of tray T has corresponding cooperating teeth so that tray T is indexable by belt B1 in direction A to substrate chute C. To accommodate trays T with different size tooth pitches p, a number of toothed belts B1-B6, with the various pitches contemplated, are mounted on a polygon drum D which is rotatably indexable about axis 2 so as to juxtapose the appropriate belt with window W. Chute C is provided with an adjustable side guide member 3 which is movable in a bidirectional manner (arrow B) and biased by the spring SP affixed thereto. With tray T in alignment with chute C, substrates S are released therefrom and fed into chute C in a serial manner. Automatic orientation detection and orientation positioning apparatus (not shown) is provided at STA. 1 to provide the desired orientation to the released substrates S for processing through the system.

At STA. 2, substrate S is juxtaposed to and aligned with a pin-holding fixture (not shown) which temporarily carries the pins P in the desired matrix configuration for insertion into substrate S. The pins P are vibrationally released from the fixture so that the pins P are shaked into the corresponding slightly larger diameter receiving holes H of substrate S, thereby mitigating any possible damage to the pins P, as might be the case, if they were to be driven in directly.

At STA. 3, substrate S, which now carries the inserted through pins P, is placed between ram and die fixtures 4 and 5, respectively.

Die fixture 5 has an array of conical or tapered openings 6, in each of wh...