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Boat Thermal Enhancement for Semiconductor Chips and Modules

IP.com Disclosure Number: IPCOM000089695D
Original Publication Date: 1977-Dec-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 37K

Publishing Venue

IBM

Related People

Shott, FA: AUTHOR

Abstract

A thermal enhancement device consists of a boat 4, upper grease interface 5 and lower grease interface 6 to efficiently spread and transfer heat produced by the semiconductor devices 7 to the module cap 1. The boat 4 is a high thermal conductivity material, such as aluminum, copper or BeO, which efficiently spreads the heat from the small chip areas to the large area of the cap 1 and any heatsink attached thereto. The boat is also an electrical insulator so as not to short out any of the circuitry or to allow the cap to become electrically charged. If the boat is made of a metal, it can be anodized to provide the necessary electrical insulation. Preferably, the boat has the shape of a square, flat plate which is thick enough to spread the heat, yet not add appreciable thermal resistance to the total heat path.

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Boat Thermal Enhancement for Semiconductor Chips and Modules

A thermal enhancement device consists of a boat 4, upper grease interface 5 and lower grease interface 6 to efficiently spread and transfer heat produced by the semiconductor devices 7 to the module cap 1. The boat 4 is a high thermal conductivity material, such as aluminum, copper or BeO, which efficiently spreads the heat from the small chip areas to the large area of the cap 1 and any heatsink attached thereto. The boat is also an electrical insulator so as not to short out any of the circuitry or to allow the cap to become electrically charged. If the boat is made of a metal, it can be anodized to provide the necessary electrical insulation. Preferably, the boat has the shape of a square, flat plate which is thick enough to spread the heat, yet not add appreciable thermal resistance to the total heat path. The square dimension of the boat is to be slightly smaller than the inside cavity of the module cap to permit small z- direction movements.

The upper or cap-to-boat grease interface 5 is a much larger contact area, and therefore the grease can be thicker and still maintain a low thermal resistance. In one embodiment the thermal grease is injected into the fill hole 2 after the module is assembled and backsealed with a suitable sealant 9. The grease is injected while in the vacuum to eliminate cap-to-boat voids or air pockets. As the grease fills the upper interface, it will take up manufacturing t...