Browse Prior Art Database

Wire Insertion and Merging Device

IP.com Disclosure Number: IPCOM000089715D
Original Publication Date: 1977-Dec-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 41K

Publishing Venue

IBM

Related People

Arnhart, JC: AUTHOR [+3]

Abstract

This article describes a method and apparatus for forming a mounting element for a semiconductor device. The mounting element is adapted to support a semiconductor device on a larger board or other support and spread out the electrical terminals of the device.

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Wire Insertion and Merging Device

This article describes a method and apparatus for forming a mounting element for a semiconductor device. The mounting element is adapted to support a semiconductor device on a larger board or other support and spread out the electrical terminals of the device.

As illustrated in Fig. 1, a wire guide die 10, provided with a plurality of grooves 12 formed in a fanned-out pattern, is positioned between a first plastic board 14 and a second board 16. Board 14 is provided with a matrix of spaced apertures 18 arranged to match the configuration of the semiconductor device which will ultimately be mounted on the mounting element. Board 16 also has a matrix of holes 20 which are spaced to match the terminal configuration on the board or other support.

In operation the upper row of holes in both matrixes are aligned with the grooves, as indicated in Fig. 2. A cover 8 is clamped over the top of die 10, completely enclosing channels 12. By a suitable wire feed mechanism 24, the wires 22 are forced through the channels until they extend beyond the holes 18 and board 14. Wires 22 are clamped in jaws 5 and pulled further, if necessary. The wires are sheared off with cut-off blade 26, the cover removed from the die, and the boards 14 and 16 moved upwardly until the second set of holes in each of the matrixes are aligned with the ends of the channels 12 and die 10. The process of feeding the wires 22 through the boards and the die is then repeate...