Browse Prior Art Database

Air Cooled Semiconductor Chip Module Configurations

IP.com Disclosure Number: IPCOM000089728D
Original Publication Date: 1977-Dec-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 70K

Publishing Venue

IBM

Related People

Metreaud, CG: AUTHOR

Abstract

Three air-cooled module configurations are depicted in the figures. The modules of Figs. 1A, 1B and 2A, 2B each house a single semiconductor chip, whereas the module of Figs. 3A, 3B houses a plurality of chips. "FUZZ BUTTON"* material is a resilient mass of fine knitted wire mesh compressed in a die to the desired shape and density. It is available in different materials, wire and finished sizes. In each of the embodiments illustrated, the cylindrical "FUZZ BUTTON" is open-fitted into a hollow protrusion formed into the module cap.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 93% of the total text.

Page 1 of 2

Air Cooled Semiconductor Chip Module Configurations

Three air-cooled module configurations are depicted in the figures. The modules of Figs. 1A, 1B and 2A, 2B each house a single semiconductor chip, whereas the module of Figs. 3A, 3B houses a plurality of chips. "FUZZ BUTTON"* material is a resilient mass of fine knitted wire mesh compressed in a die to the desired shape and density. It is available in different materials, wire and finished sizes. In each of the embodiments illustrated, the cylindrical "FUZZ BUTTON" is open-fitted into a hollow protrusion formed into the module cap.

The "BUTTON" interface with the chip is through a thin pellet of solder, indium or indium alloy (not shown). At reflow the solder will infiltrate the lower part of the "FUZZ" by capillary attraction, and form a solid and conforming pad in contact with the chip. As a result, a continuous, but resilient, thermal path is formed between the chip and the module cap. Notable in this concept are the following: (a) The "FUZZ"-solder composite pad at the chip end of the "FUZZ- BUTTON'' occupies a small fraction of the overall length of the button; therefore, the button retains its resiliency. (b) By design, the button is preloaded at assembly so that a constant, but measured, force is applied on the chip. (c) As a consequence of (a) and (b), a permanent and intimate contact is established between button and chip which will not be affected by manufacturing tolerances and thermal expansion of th...