Browse Prior Art Database

Module Thermal Cap for Semiconductor Chip Package

IP.com Disclosure Number: IPCOM000089729D
Original Publication Date: 1977-Dec-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 3 page(s) / 78K

Publishing Venue

IBM

Related People

Meeker, RG: AUTHOR [+3]

Abstract

The structures disclosed are encapsulated cooling modules wherein one or more semiconductor chips to be cooled are supported on a substrate portion of the module. Reference is made to the gas encapsulated cooling module disclosed in U.S. Patent 3,993,123.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 65% of the total text.

Page 1 of 3

Module Thermal Cap for Semiconductor Chip Package

The structures disclosed are encapsulated cooling modules wherein one or more semiconductor chips to be cooled are supported on a substrate portion of the module. Reference is made to the gas encapsulated cooling module disclosed in U.S. Patent 3,993,123.

In Fig. 1, the stud includes parts 1A and 1B. The semi-spherical part 1B is free to rotate with the socket part 1A. The planar surface of the semi-spherical part aligns itself with the opposing planar surface of the chip. This improves the thermal contact resistance between the chip and the stud (chip/stud interface).

In Fig. 2, the alignment of the cooling stud 2A with the chip planar surface is achieved by means of a flexible bellows. The assembly has two chambers, A and B, which are hermetically sealed from each other. Chamber B may be filled with inert gas, or the like, and chamber A may have cooled water, or the like, circulated therethrough to remove the heat from the stud.

In Fig. 3, the chips are cooled by nucleate boiling of FC-86. Copper stud 3A is in contact with the planar surface of the chip to increase the heat flow by conduction. The FC-86 will surround the chip and improve the thermal contact resistance at the chip/stud interface. Heat removal by conduction is an order of magnitude better than nucleate boiling.

In Fig. 3, the copper stud 3A is attached to the module cap by a curved beryllium copper spring. The module cap has sleeves into which the...