Browse Prior Art Database

Resole Polymeric Adhesion Promoters

IP.com Disclosure Number: IPCOM000089732D
Original Publication Date: 1977-Dec-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Fredericks, EC: AUTHOR

Abstract

The adhesion of positive or negative resist layers to surfaces, such as silicon dioxide on silicon, is improved by the use of a resole resin adhesion layer.

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Resole Polymeric Adhesion Promoters

The adhesion of positive or negative resist layers to surfaces, such as silicon dioxide on silicon, is improved by the use of a resole resin adhesion layer.

Clean silicon wafers with a surface layer of sputtered quartz are spin coated with a thin, 1,400 Angstrom layer of a resole resin and baked on a 160 degree C hotplate for 15 minutes. A positive-acting diazo ketone sensitized phenol- formaldehyde novolak resist layer is then spin coated the onto the resole resin layer, prebaked on a hotplate, imagewise exposed, and developed to remove the exposed areas with an aqueous alkaline developer to obtain a 25-30% overdevelopment. The developed resist layers have excellent adhesion to the wafer surface.

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