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Etch Process End Point Detect Measurement Test Site

IP.com Disclosure Number: IPCOM000089733D
Original Publication Date: 1977-Dec-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Saraf, LH: AUTHOR [+2]

Abstract

Because planar quartz retains quartz spikes above metal lines when the lines are greater than 140 microinch in width, a test site with metal lines of the same product dimension width will have spikes which will prevent detection of a repeatable distinct sharp change at end point. This is overcome by reducing in the test site the width of metal lines to under 100 microinch separated by 150 microinch spaces, thereby essentially eliminating the quartz spikes. During blanket etching of quartz, a repeatable sharp change is detected in the test site as etching reaches the metal in the test site. Then, the wafer is over-etched slightly to remove the quartz spikes in the product sites.

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Etch Process End Point Detect Measurement Test Site

Because planar quartz retains quartz spikes above metal lines when the lines are greater than 140 microinch in width, a test site with metal lines of the same product dimension width will have spikes which will prevent detection of a repeatable distinct sharp change at end point. This is overcome by reducing in the test site the width of metal lines to under 100 microinch separated by 150 microinch spaces, thereby essentially eliminating the quartz spikes. During blanket etching of quartz, a repeatable sharp change is detected in the test site as etching reaches the metal in the test site. Then, the wafer is over-etched slightly to remove the quartz spikes in the product sites.

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