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Liquid Encapsulated Conduction Module

IP.com Disclosure Number: IPCOM000089764D
Original Publication Date: 1977-Dec-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 47K

Publishing Venue

IBM

Related People

Hwang, UP: AUTHOR [+2]

Abstract

A cooling enclosure for high density chip packaging is provided incorporating the advantages of conduction cooling techniques supplemented by liquid encapsulation that is noncritical of fluid leakage.

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Liquid Encapsulated Conduction Module

A cooling enclosure for high density chip packaging is provided incorporating the advantages of conduction cooling techniques supplemented by liquid encapsulation that is noncritical of fluid leakage.

The conduction module contains a piston 10 for each of the chips 12 to be cooled. Each piston 10 is spring-loaded so that the piston end is in contact with the chip backside surface. This provides the thermal conduction path from chip to piston. Since each piston 10 is free to move within the module housing 14, a small clearance space 16 is provided. Also, full contact is never to be expected between the chip surface and piston end since irregularities in the substrate 18 surface, together with slight piston cocking, can occur.

The entire cavity 20 is filled with transformer oil 22 or other suitable dielectric fluid having a high thermal conductivity. The transformer oil has three times the thermal conductivity of most dielectric fluids of the fluorocarbon type. The oil offers the advantage of a leak-free module with inexpensive sealing techniques, filling procedures and fluid costs. The oil also offers lubrication for the moving parts within this assembly.

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