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Design for Providing Thermal Interface Material Between Narrow Thermal Interface Gaps

IP.com Disclosure Number: IPCOM000089765D
Original Publication Date: 1977-Dec-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 46K

Publishing Venue

IBM

Related People

Chu, RC: AUTHOR

Abstract

Thermal interface materials, such as grease, compound, liquid or gas, can be provided at the critical interface between heat sources and intermediate heat sink bodies as needed.

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Design for Providing Thermal Interface Material Between Narrow Thermal Interface Gaps

Thermal interface materials, such as grease, compound, liquid or gas, can be provided at the critical interface between heat sources and intermediate heat sink bodies as needed.

Each piston 10 has a small cylindrical opening 12 drilled therein which is first filled with a low-boiling-point liquid 14, such as one of the fluorocarbons, and is then filled with thermal interface material 16. The low-boiling-point liquid 14 can be a binary mixture of two liquids to achieve the desired vapor-temperature relationship. The liquid 14 is designed to provide low and initial pressure actuated by temperature for the spreading of the thermal compound 16. The temperature applied also reduces the viscosity of the thermal interface material 16 and makes it flow easier. There are two basic interfaces involved: the chip-to- piston interface 18, and the piston-to-cylinder interface 20. The material stored in the drilled mini-cylinders 12 will wet the chip-to-piston interface.

A further small cylinder 22 is drilled in the bottom of the cylindrical opening within the housing, into which the piston 10 fits. This small cylindrical opening 22 is likewise filled with a low-boiling-point liquid 14, and the area above it, which is the bottom of the cylindrical opening, is filled with a thermal grease 16 or the equivalent. The main cylinder opening walls contain mini-channels 24 to wet the interface 20 betw...