Browse Prior Art Database

Multiwire Slab Cutting Tool for Silicon Wafers

IP.com Disclosure Number: IPCOM000089816D
Original Publication Date: 1977-Dec-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 44K

Publishing Venue

IBM

Related People

Siegel, AR: AUTHOR

Abstract

This article describes an electro-discharge machining for cutting slots in conductive materials, such as silicon wafers.

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Multiwire Slab Cutting Tool for Silicon Wafers

This article describes an electro-discharge machining for cutting slots in conductive materials, such as silicon wafers.

Specifically, the cutting tool includes an aluminum cylindrical block 10 having a series of external threads cut as V-shaped grooves around the perimeter of the block 1, such that an electrical wire 14 is wrapped and retained in such grooves. Prior to the wrapping of the wires 14, a rectangular slot 16 is cut along the longitudinal rim of block 10 such that the wires 14 extend across the slot 16. A conductive epoxy line 18 is applied longitudinally in one or two strips along the external surface of the block 10 so as to hold down the wires 14.

The cutting tool is engaged with a wafer (not shown) such that the electrical discharge of the wires 14 extending across the slot 16 will cut a multiplicity of lines into the wafer. Additionally, an axial feed hole 20 extends through the block 10 and has a plurality of side passages 22 extending down into the rectangular slot 16 for spraying oil from a supply into the passages 22 and, thereby, flushing eroded particles away from the cutting areas.

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